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Integrated circuits dynamic high temperature burn-in test system(GPIC2030)

The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~200°C. The current and output signal of the component are monitored in real time during the burn-in process.

Function

Real-time monitoring of the current and output signal of the component
With gold finger connector
Customized burn-in test board according to different component packaging, power and other requirements

Product Features

Test temperature zone	1
Test temperature	RT+10℃~200℃
Test zone	32
Digital signal frequency	12.5MHz(optional 20MHz)
Digital signal programming depth	16M depth
Digital signal programming step	40nS~0.5S
Digital signal channels	128 channels bi-directional (64 channels optional)
Digital signal mode	Support signalcycle,step jumping and other modes
Maximum driving current of digitalsignal	loh≥150 mA,lol≥150 mA
Analog signal output channel	4
Maximum driving current of analog signal	1A
Analog signal frequency	1Hz~5MHz
Analog signal synchronization phase	≤1°
Analog signal type	Arbitrary waveforms such as sine, triangle, leading-edge sawtooth, trailing-edge sawtooth, and adjustable pulse width square waveforms
Secondary power supply	4 channels,0.5~20V/15A
Current detection range	0~15A
Voltage detection range	0~20V
Machine power supply	Three-phase AC380±38V
Maximum power	15KW(typical)
Total weight	1100KG (typical)
Dimensions of machine	1500mm(W)×1400mm(D)×2000mm(H)

Applicable standards

GJB548B MIL-STD-883 MIL-STD-38510 AEC-Q101 JESD22A-108

Applicable components

For various analog circuits, digital circuits, digital-analog hybrid, opto-couplers, MCU, FPGA and other general-purpose integrated circuits