Large Scale Integrated Circuit Burn-in Test System(LSIC9000)
The system can perform HTOL test on the chip at room temperature +10°C~150°C. The outputsignal of the component is monitored in real time and the vector is automatically compared during the burn-in process.
Function
- Each burn-in board provides 10 programmable power supplies (0.5~10V/0~25A), and the power supply specifications can be customized individually
- Each burn-in board is available with 256 bidirectional I/O channels
- Each chamber can support up to 38kw of heat dissipation
- Vector files in STIL, VCT, VEC formats can be directly imported and used
- Chip BIST test is allowed
- Supports up to 24 independent temperature control workstations
- Full experimenter human safety considerations are set
Product Features
Test Temperature Zones | 1 |
Test temperature | RT +10℃~150℃ |
Burn-in Test Zones | 32 |
Digital Signal Frequency | 10MHz |
Vector Depth | 16M depth |
Signal Channels | 256 independent programmable bidirectional I/O |
Clock Groups | 8 |
Signal Period | 80~20480nS |
Timing Edges | 2 edges |
PIN Formats | 8 types |
Programmable VIH | 0.5~5V |
Voltage compare range | 0.5~5V |
IO drive current | DC≥50mA, Instantaneous current>80mA |
DPS power supply | 0.5~6.0V/25A (10V/10A optional) |
DPS power supplies | 10 (can be configured according to customer requirement) |
DPS output protection | OVP(Overvoltage) ,UVP(Undervoltage) ,OCP(Overcurrent) |
Machine power supply | Three-phase AC380±38V |
Maximum power | 100KW (typical) |
Total weight | 2200KG (typical) |
Dimensions of machine | 2500mm(W)×1450mm(D)×2470mm(H) |
Applicable standards
MIL-STD-883 MIL-STD-38510 AEC-Q101 JESD22A-108
Applicable components
For general-purpose VLSI circuits, SOC, FPGA, ARM, AI, and low-power GPUs.