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High temperature reverse bias burn-in test system(HTRB2000)

The system can perform the high temperature reverse bias burn-in test at room temperature +10℃~+200℃. During the burn-in process, it can monitor the leakage current state and voltage state of the tested component in real time, record and export the burn-in test data as required.

Function

  • nA level leakage current detection accuracy
  • 30s full station data refresh of the machine
  • Unique high-voltage suppression circuit, instantaneous breakdown of components, without affecting burn-in process of other stations
  • Customized independent control function of burn-in voltage of the work station to eliminate the burn-in overrun of a single station
  • Customizable positive and negative power supplies to achieve simultaneous application of bias voltage to the upper and lower bridges of the module
  • Full experimenter human safety considerations are set

Product Features

Test temperature zone

1

Test temperature

RT+10~200℃

Test zone

16(16/32/40/48 zone optional)

Stations per zone

80 (typical)

Burn-in voltage

0~±2000V

Voltage detection accuracy

±(1%+2LSB)

Current detection

10nA~50mA

Current detection accuracy

±(1%+10nA)

Machine power  supply

Three-phase  AC380±38V

Maximum power

8KW (typical)

Total weight

680Kg (typical)

Dimensions of machine

1400mm(W)×1400mm(D×2000mm(H)


Applicable standards

MIL-STD-750D AQG324

Applicable components

For MOS transistor, diode, triode, IGBT module, PIM module, SCR, etc.