High temperature reverse bias burn-in test system(HTRB2000)
The system can perform the high temperature reverse bias burn-in test at room temperature +10℃~+200℃. During the burn-in process, it can monitor the leakage current state and voltage state of the tested component in real time, record and export the burn-in test data as required.
Function
- nA level leakage current detection accuracy
- 30s full station data refresh of the machine
- Unique high-voltage suppression circuit, instantaneous breakdown of components, without affecting burn-in process of other stations
- Customized independent control function of burn-in voltage of the work station to eliminate the burn-in overrun of a single station
- Customizable positive and negative power supplies to achieve simultaneous application of bias voltage to the upper and lower bridges of the module
- Full experimenter human safety considerations are set
Product Features
Test temperature zone | 1 |
Test temperature | RT+10~200℃ |
Test zone | 16(16/32/40/48 zone optional) |
Stations per zone | 80 (typical) |
Burn-in voltage | 0~±2000V |
Voltage detection accuracy | ±(1%+2LSB) |
Current detection | 10nA~50mA |
Current detection accuracy | ±(1%+10nA) |
Machine power supply | Three-phase AC380±38V |
Maximum power | 8KW (typical) |
Total weight | 680Kg (typical) |
Dimensions of machine | 1400mm(W)×1400mm(D×2000mm(H) |
Applicable standards
MIL-STD-750D AQG324
Applicable components
For MOS transistor, diode, triode, IGBT module, PIM module, SCR, etc.