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LSIC7000

Very large scale integration circuits burn-in test system
The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~150°C. The output signal of the component is monitored in real time during the burn-in process and the vector is automatically compared.

LSIC9000

Large Scale Integrated Circuit Burn-in Test System
The system can perform HTOL test on the chip at room temperature +10°C~150°C. The outputsignal of the component is monitored in real time and the vector is automatically compared during the burn-in process.

GPIC2010

Integrated circuits dynamic high temperature burn-in test system
The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~200°C. The current and output signal of the component are monitored in real time during the burn-in process.

GPIC2020

Integrated circuits dynamic high temperature burn-in test system
The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~200°C. The current and output signal of the component are monitored in real time during the burn-in process.

GPIC2030

Integrated circuits dynamic high temperature burn-in test system
The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~200°C. The current and output signal of the component are monitored in real time during the burn-in process.