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IGBT power cycle test system(PC1800A)

The system is suitable for power cycling test of various sizes of IGBT modules and uses the advanced JEDEC static test method (JESD51-1) to generate temperature changes by varying the input power of the electronic component. During the change, through transient temperature response curve of the tested chip and data processing of the test waveform to obtain the full thermal characteristics of the electronic component.

Function

  • Supports minute/second power cycling test
  • Equipped with oil-cooled platform, which can and automatically calibrate the K-factor of the component quickly
  • Fixture supports adjustable strength and depth for effective clamping of different packaging of modules
  • With solenoid water valve, can automatically adjust the cooling water flow according to the actual situation, or manually adjust
  • Through the transient temperature response curve of the test component, data processing of the test waveform to obtain
  • the comprehensive thermal characteristics of the electronic component

Product Features

Test temperature zone

2

Test temperature

Water cooling plate:10~80 ℃,
oil cooling plate:-10~150 ℃

Test zone

3

Constant temperature system
control accuracy

water cooling system:±0.5℃
oil cooling system:±0.1℃

Junction temperature test accuracy

±2℃

Cold plate and shell temperature
testing accuracy

±2℃

Heating current

600A/zone (supporting three zones in parallel 1800A)
1000A/zone (supporting three zones in parallel 3000A)

Test current

10~1000mA

Test current accuracy and resolution

±(0.3%+2mA), resolution 0.5mA

Machine power supply

Three-phase AC380±38V

Maximum power

30KW(typical)

Total weight

500KG (typical)

Dimension of machine
(without water cooler)

1400mm(W)×900mm(D)×1300mm(H)


Applicable standards

GJB128 JESD51 AQG324

Applicable components

For various sizes of IGBT modules and Mos modules