Dynamic high temperature high humidity reverse bias burn-in test system(DH3TRB2000)
The system performs dynamic high temperature and humidity reverse bias burn-in test for SiC MOSFET with reference to AQG324 for the test method. Up to 6 stations can be tested in each test area, with independent pulse source configurations. A standard 85°C/85%RH test environment is available for the device. It has the function of short-circuit disengagement test of test device, which can automatically detach the faulty device from the burn-in test circuit without affecting the normal test of other devices.
Function
- nA-level leakage current detection accuracy
- dv/dt>30v/ns (Coss<300pF)
- The whole machine is refreshed in 30s for full-station data
- Unique high-voltage suppression circuit, the instantaneous breakdown of the device does not affect the burn-in process of other stations
- The independent control function of the burn-in voltage of the station can be customized to realize the over-limit rejection of the burn-in of a single station
- Full experimenter human safety considerations are set
Product Features
Test temperature | RT +10℃~+150℃ |
Test humidity | 10%RH~98%RH |
Test Method | VGS,off = VGS,min and VGS,on = VGS,max |
Burn-in test zone | 14 (14/16 zone Optional) |
Stations per zone | 6 (typical) |
Voltage detection range | 50V~1200V |
Voltage detection accuracy | Detection deviation; ±(2%+1V) |
Pulse control | 1. Pulse frequency (square wave): 10kHz~50kHz; Accuracy: 2%±2LSB |
VGS voltage test & control range | Passive: -0.7V~ -20V/0V |
Leakage current detection | Detection range: 0.1uA~20mA |
Machine power supply | Three-phase AC380±38V |
Total weight | 1200Kg (typical) |
Dimensions of machine | 2000mm(W)×1505mm(D)×1950mm(H) |
Applicable standards
AEC-Q101 AQG324 JESD22-A108 JEDEC JEP183A
Applicable components
For SiC, GaN, IGBT module, MOS transistor