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Integrated circuits dynamic high temperature burn-in test system(GPIC2010)

The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~200°C. The current and output signal of the component are monitored in real time during the burn-in process.

Function
  •  Real-time monitoring of the current and output signal of the component
  •  With gold finger connector
  •  Customized burn-in test board according to different component packaging, power and other requirements
Product Features

Test temperature zone

1

Test temperature

RT+10℃~200℃

Test zone

48

Digitalsignal frequency

12.5MHz(optional   20MHz)

Digital signal programming depth

16M  depth

Digital signal programming step

40nS~0.5S

Digitalsignal channels

128 channels bi-directional (64 channels optional)

Digitalsignal mode

Support signal cycle, step jumping andother modes

Maximum driving current of digital signal

Ioh≥150 mA, Iol≥150 mA

Analog signal output channel

4

Maximum driving current of analog signal

1A

Analog signal frequency

1Hz~5MHz

Analog signal synchronization phase

≤1°

Analog signal type

Arbitrary waveforms such as sine, triangle, leading-edge sawtooth,
trailing-edge sawtooth, and adjustable pulse width square waveforms

Secondary power  supply

4 channel,0.5~20V/15A

Current detection

0~15A

Voltage detection

0~20V

Machine power  supply

Three-phase AC380±38V

Maximum    power

20KW (typical)

Total weight

1350KG  (typical)

Dimensions of machine

1500mm(W)×1400mm(D)×2000mm(H)


Applicable standards

GJB548B MIL-STD-883 MIL-STD-38510 AEC-Q101 JESD22A-108 GPIC2010 The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~200°C. The current and output signal of the component are monitored in real time during the burn

Applicable components

For various analog circuits, digital circuits, digital-analog hybrid, opto-couplers, MCU, FPGA and other general-purpose integrated circuits