ConsultIntegrated circuits dynamic high temperature burn-in test system(GPIC2010)
The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~200°C. The current and output signal of the component are monitored in real time during the burn-in process.
Function
- Real-time monitoring of the current and output signal of the component
- With gold finger connector
- Customized burn-in test board according to different component packaging, power and other requirements
Product Features
Test temperature zone | 1 |
Test temperature | RT+10℃~200℃ |
Test zone | 48 |
Digitalsignal frequency | 12.5MHz(optional 20MHz) |
Digital signal programming depth | 16M depth |
Digital signal programming step | 40nS~0.5S |
Digitalsignal channels | 128 channels bi-directional (64 channels optional) |
Digitalsignal mode | Support signal cycle, step jumping andother modes |
Maximum driving current of digital signal | Ioh≥150 mA, Iol≥150 mA |
Analog signal output channel | 4 |
Maximum driving current of analog signal | 1A |
Analog signal frequency | 1Hz~5MHz |
Analog signal synchronization phase | ≤1° |
Analog signal type | Arbitrary waveforms such as sine, triangle, leading-edge sawtooth, |
Secondary power supply | 4 channel,0.5~20V/15A |
Current detection | 0~15A |
Voltage detection | 0~20V |
Machine power supply | Three-phase AC380±38V |
Maximum power | 20KW (typical) |
Total weight | 1350KG (typical) |
Dimensions of machine | 1500mm(W)×1400mm(D)×2000mm(H) |
Applicable standards
GJB548B MIL-STD-883 MIL-STD-38510 AEC-Q101 JESD22A-108 GPIC2010 The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~200°C. The current and output signal of the component are monitored in real time during the burn
Applicable components
For various analog circuits, digital circuits, digital-analog hybrid, opto-couplers, MCU, FPGA and other general-purpose integrated circuits