The LSIC burn-in test system is designed for evaluating the burn-in performance of semiconductor chips. Semiconductor chips may experience burn-in phenomena after prolonged operation, such as decreased capacitance and increased leakage current.

Hangke BurnIn-Matrix Monitor, a matrix-style burn-in monitoring platform, has complete functions such as data acquisition, monitoring management and analysis, real-time alerts, quick identification of problematic devices, large-screen display, and etc.

The "Intelligent Burn-in Central Monitoring System (IBCS)" is a platform-level data processing and presentation center that features centralized management, digital applications, and visual representation.