Consult

Integrated circuits dynamic high temperature burn-in test system(GPIC2010)

The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~+200°C. The current and output signal of the componentare monitored in real time during the burn-in process.

Function

Real-time monitoring of the current and output signal of the component
With gold finger connector
Customized burn-in test board according to different component packaging, power and other requirements
Full experimenter human safety considerations are set

Product Features

Test temperature zone	1
Test temperature	RT +10℃~+200℃
Burn-in test zone	48 (16/32 zone optional)
Digital signal frequency	10MHz (optional 20MHz)
Digital signal programming depth	8 Mbit channel
Digital signal programming step	50nS ~ 0.5S
Digital signal channels	64 channels
Digital signal mode	Support signal cycle
Maximum driving current of digital signal	Ioh≥150mA, Iol≥150 mA
Analog signal output channel	4
Maximum driving current of analog signal	0.5A
Analog signal frequency	1Hz ~ 2MHz
Analog signal synchronization phase	≤1°
Analog signal type	Arbitrary waveforms such as sine, triangle, leading-edge sawtooth, trailing-edge sawtooth
Secondary power supply	4 channel, 0.5~18V/10A
Current detection range	0~10A
Voltage detection range	0~18V
Machine power supply	Three-phase AC380 ±38V
Maximum power	20KW (typical)
Total weight	950Kg (typical)
Dimensions of machine	1700mm(W)×1400mm(D)×2000mm(H)

Applicable standards

MIL-STD-883 MIL-STD-38510

Applicable components

For various analog circuits, digital circuits, digital-analog hybrid, opto-couplers, MCU, FPGA and other general-purpose integrated circuits.