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Large Scale Integrated Circuit Burn-in Test System(LSIC9000)

The system can perform HTOL test on the chip at room temperature +10°C~+150°C. The output signal of the component is monitored in real time and the vector is automatically compared during the burn-in process.

Function

Each burn-in board provides 10 programmable power supplies (0.5~10V/0~25A), and the power supply specifications can be customized individually
Each burn-in board is available with 256 bidirectional I/O channels
Each chamber can support up to 38kw of heat dissipation
Vector files in STIL, VCT, VEC formats can be directly imported and used
Chip BIST test is allowed
Supports up to 24 independent temperature control workstations
Full experimenter human safety considerations are set

Product Features

Test temperature zone	1
Test temperature	RT +10℃~+150℃
Burn-in test zone	32
Digital signal frequency	10MHz
Vector depth	16M depth
Signal channels	256 independent programmable bidirectional I/O
Clock grer su	8
Signal period	80-20480nS
Timing edge	2 edges
PIN format	8 types
Programmable VlH	0.5-5V
Voltage compare range	0.5-5V
I/O drive current	DC≥100mA,Instantaneous current >200mA
DPS power supply	0.5-6.0V/25A(10V/10A,6V/50A optional)
DPS power supplies	10 (can be configured according to customer requirement)
DPS output protection	OVP(Overvoltage),UVP(Undervoltage),OCP(Overcurrent)
Machine power supply	Three-phase AC380+38V
Maximum power	100KW (typical)
Total weight	2200Kg (typical)
Dimensions of machine	2800mm(W)x1480mm(D)x2310mm(H)

Applicable standards

MIL-STD-883 MIL-STD-38510 AEC-Q101

Applicable components

For general-purpose VLSI circuits, SoC, FPGA, ARM, AI, and low-power GPUs.