HTXB2000
High temperature bias burn-in test system
The system can perform high-temperature reverse bias and gate bias burn-in testing at room
temperature+10℃~+200℃, and monitor the leakage current state and voltage state of the tested
device in real-time during the burn-in process. Current state, voltage state of the tested device,
and record burn-in test data as needed, and export test reports.