Large scale integrated circuit burn-in test system(LSIC7000)
The system supports dual temperature zones, and can carry out HTOL burn-in test at room tempera-ture +10°C~+150°C, and detect the output signal of the device in real time during the burn-inprocess, in which the vectors are automatically compared.
Function
- Each burn-in board provides 8 programmable power supplies (0.5~10V/0~25A),and the power supply specifications can be customized individually
- Each burn-in board is available with 184 DR channels and 32 bidirectional I/O channels
- Each chamber can support up to 4 kw of heat dissipation
- Vector files in STIL, VCT, VEC formats can be directly imported and used
- Chip BIST test is allowed
- Fully compatible with DL601H machined burn-in boards, plug and play
- Full experimenter human safety considerations are set
Product Features
Test temperature zone | 2 |
Test temperature | RT+10℃~+150℃ |
Burn-in test zone | 16 ZONE/32 SLOTS |
Digital signal frequency | 12.5MHz |
Vector depth | 16M depth |
Signal channels | 184 channels (including 32 bidirecional l/O) |
Clock groups | 8 |
Signal period | 80~20480nS |
Timing edge | 2 edges |
PiN format | 8 types |
Programmable VlH | 0.5~5V |
Voltage compare range | 0.5~5V |
I/O drive current | DC≥50mA,Instantaneous current>80mA |
DPS power supply | 0.5~6.0W/25A(10V/10A optional) |
DPS power supplies | 8 (can be configured according to customer requirements) |
DPS output protection | OVP (Overvoltage).UVP (Undervoltage).0CP (Overcurrent) |
Machine power supply | Three-phase AC380+38V |
Maximum power | 35KW (typical) |
Total weight | 1600Kg (typical) |
Dimensions of machine | 3200mm(W)x1675mm(D)x2370mm(H) |
Applicable standards
MIL-STD-883 MIL-STD-38510 AEC-Q101
Applicable components
For general-purpose integrated circuit memory, FPGA, ARM, DSP and other VLSI.

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