Consult

Very large scale integration circuits burn-in test system(LSIC7000)

The system adopts TDBI technology and can perform HTOL burn-in test at room temperature +10°C~150°C. The output signal of the component is monitored in real time during the burn-in process and the vector is automatically compared.

Function

Real-time detection of the signal and current state of the component, automatic process vector comparison
Select hard metric high-speed connectors to greatly improve test signal integrity
Customized special burn-in test board according to different component packaging and power requirements
Adopt special high-current connectors, with high reliability and stability, MTBF more than 20,000 hours

Product Features

Test temperature zone	2
Test temperature	RT+10℃~150℃
Test zone	16/32
Digital signal frequency	12.5MHz
Vector depth	16Mdepth
Signal channels	184 channels (including 32 bi-directional IO)
Clock groups	8
Signal period	80~20480nS
Programmable clockes	2 edges
PIN format	8
Programmable VIH	0.5~5V
I0 drive current	DC≥50mA,Instantaneous current≥80mA
DPS power supply	0.5~6.0V/25A(10V/10A optional)
DPS power supplies	2~8(can be configured according to customer requirements）
DPS output protection	OVP(Overvoltage) ,UVP(Undervoltage) ,OCP(Overcurrent）
Machine power supply	Three-phase AC380±38V
Maximum power	35KW (typical)
Total weight	1600KG (typical)
Dimensions of machine	3200mm(W)×1674mm(D)×2366.2mm(H)

Applicable standards

GJB548B MIL-STD-883 MIL-STD-38510 AEC-Q101 JESD22A-108

Applicable components

For general-purpose integrated circuit memory, FPGA, ARM, DSP and other VLSI