Consult

Wafer-level reliability test system(CWBS1000)

The system is suitable for electrical reliability test for controllable high-temperature for 6/8-inch wafer-level devices based on JEDEC reliability test standard; It provides high-precision and high-voltage output, and saves records high-precision current, controllable temperature and other parameters, and according to the recorded test data, export experiment tables and MAP diagrams in multiple formats.

Function

Customized high-temperature adjustment semi-automatic probe station, supporting ≤5 wafers simultaneous burn-in test
Support the independent protection function of each wafer die, and control the over-current and over-voltage beyond the limit
Support nitrogen protection to prevent wafer oxidation, and support overvoltage protection when filling
Support to change the Burn-in Board or probe card to different package devices for test
Support wafer mounting contact spot detection, real-time temperature and pressure detection
Support HTGB, HTRB and other burn-in test functions, Vth/IDS/IGS and other parameters of automatic testing and data analysis
Support built-in wafer layout MAP configuration, real-time display of data and query of historical data
Support access to the centralized control station (smart core protection cloud) system, customized docking with the MES system

Product Features

Test temperature zone	1 (Support customization ≤5)
Test temperature	RT-200℃
Applicable products	GaN/SiC and other 6-inch and 8-inch wafers
Multi-station parallel test	1 (Support customization ≤5)
Temperature overshoot	＜2℃
Grid voltage range (accuracy)	±60V(0.1%±10mV)
Grid current range (accuracy)	HTGB: 0.1nA~1uA (1%±100pA) Vth: 0~20mA (0.1%±20uA)
Source voltage range (accuracy)	50~2000V(0.5%*Vmax±1V)
Source current range (accuracy)	1nA~1mA(1%±5nA)
Voltage and current overshoot	HTRB overshoot<2%,HTGB overshoot<200mV
Methods of communication	TCP network/485 serial port
Operating system	Windows 7 and above
MES system interface	Customize and integrate with third-party systems and data
Total weight	850Kg
Dimensions of machine	2050mm(w)x1400mm(D)x1750mm(H)
Single-chamber size	1920mm(w)x1250mm(D)x300mm(H)

Applicable standards

AEC-Q101 JEP183 IEC60749-23 JESD22-A108F

Applicable components

For high-temperature and high-voltage reliability test of wafers such as GaN/SiC, and automatic test and data analysis of Vth, Igs, Ids and other parameters.