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High temperature burn-in test system for power module(MPS2000)

The system provides high temperature environment and test conditions (including input power supply, load, output voltage, load current, etc.) for the test requirements of power module, and also detects various test conditions, including input voltage, test chamber temperature, component output voltage, output current, and other main parameters. The system can adapt to the life screening test and secondary screening test of various components in research institutes, microcircuit component manufacturers, etc. and is applicable to the test requirements of small batch and multiple varieties.

Function

Real time monitor electric stress, temperature stress and other information of the tested component, and automatic recording of process information
The high-speed acquisition system adopts high-speed and high-precision ADC sampling
Full experimenter human safety considerations are set

Product Features

Test temperature zone	1
Test temperature	RT+10~+200℃
Burn-in test zone	16(16/24/32 zone optional)
Burn-in board interface	High current pin hole connector or finger connector
Electronic loads	Single zone 12/16 channel, whole machine 192~512
Optional primary power supply	40V/60V/100V/300V/600V
Linear dissipative 10V plus and minus load	0.8~10VDC, 300mA~30A, 32W, constant current accuracy ±(1﹪+50mA), can be connected in parallel
Linear dissipative 30V plus and minus load	0.8~30VDC, 50mA~6.25A, 32W, constant current accuracy ±(1﹪+5mA), can be connected in parallel
Linear dissipative 100V plus and minus load	±3.3~±100VDC, ±(50mA~5A), 32W, Constant current accuracy ±(1﹪+5mA), can be connected in parallel
Shell temperature control range and accuracy (optional)	60~125℃, ±(1﹪+1℃)
Machine power supply	Three-phase AC380V±38V
Maximum power	12KW(typical)
Total weight	680KG(typical)
Dimensions of machine(mm)	1400mm(W)×1400mm(D)×2000mm(H)(16zone)

Applicable standards

MIL-STD-883D MIL-M-28787 AEC-Q100 JESD22-A108 GB2423

Applicable components

For DC/DC power module, LDO integrated circuit, BUCK integrated circuit, DRMOS integrated circuit.