IGBT power cycle reliability test system (sec)(PC1800C/3000C/3600C)

The system is suitable for power cycling test of various sizes of IGBT modules and uses the advanced JEDEC static test method (JESD51-1) to generate temperature changes by varying the input power of the electronic component. During the change, through transient temperature response curve of the tested chip and data processing of the test waveform to obtain the full thermal characteristics of the electronic component.

Function

Supports minute/second power cycling test
Equipped with oil-cooled platform, which can quickly and automatically calibrate the K-factor of the component
Fixture supports adjustable strength and depth for effective clamping of different packaging of modules
With solenoid water valve, can automatically adjust the cooling water flow according to the actual situation, or manually adjust
Through the transient temperature response curve of the test component, data processing of the test waveform to obtain the comprehensive thermal characteristics of the electronic component
Full experimenter human safety considerations are set

Product Features

Test temperature zone	3
Test temperature	Water cooling plate: +10°C~+80°C
Test zone	3
Constant temperature system control accuracy	Water cooling system: ±0.5°C
Junction temperature test accuracy	±2°C
Cold plate and shell temperature testing accuracy	±2°C
Heating current	600A/zone (supporting three zones in parallel 1800C) 1000A/zone (supporting three zones in parallel 3000C) 1200A/zone (supporting three zones in parallel 3600C)
Test current	±(10mA~1000mA)
Test current accuracy and resolution	±(0.3%+2mA), resolution 0.1mA
Machine power supply	Three-phase AC380V±38V
Maximum power	30KW (typical)
Total weight	500Kg (typical)
Dimension of machine (without water cooler)	1900mm(W)×900mm(D)×1300mm(H)

Applicable standards

JESD 51、AQG 324

Applicable components

For various sizes of IGBT module and SiC MOSFET.