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Power Cycling Test System
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IOL3000

Power cycle reliability test system (min)
This system is suitable for various packages (including F-type, TO-220, TO-247, TO-254, TO-257, TO-258, TO-3P, SMD-0.5, SMD-1, SMD-2, etc.) of high-power diodes, MOS transistor and other power devices for power cycling test and constant current power test. Each zone air duct of the system is independent, to fully avoid the impact of different test processes in different locations on the test results; During the experiment, machine can monitor the voltage and junction temperature characteristics of the component, and provide the junction temperature characteristic curve for later data analysis.

PC1800A/3000A/3600A

IGBT power cycle reliability test system (sec)
The system is suitable for power cycling test of various sizes of IGBT modules and uses the advanced JEDEC static test method (JESD51-1) to generate temperature changes by varying the input power of the electronic component. During the change, through transient temperature response curve of the tested chip and data processing of the test waveform to obtain the full thermal characteristics of the electronic component.

PC1800C/3000C/3600C

IGBT power cycle reliability test system (sec)
The system is suitable for power cycling test of various sizes of IGBT modules and uses the advanced JEDEC static test method (JESD51-1) to generate temperature changes by varying the input power of the electronic component. During the change, through transient temperature response curve of the tested chip and data processing of the test waveform to obtain the full thermal characteristics of the electronic component.