
The system performs dynamic high temperature gate bias burn-in test capabilities for the third-generation SiC MOS transistor, and each test area can independently burn up to 12 work stations. Independently 12 configurable pulses, and the leakage current of the test gate does not interfere with each other. The device is available at RT~200°C. It has the function of short-circuit disengagement test of test device, which can automatically detach the faulty device from the burn-in test without affecting the normal test of other devices.
Test temperature | RT~200°C (thermal plate) |
Test zone | 8 (Scalable) |
Stations per zone | 12 (typical) |
Test method | VDS =0V, VGS, off = VGS, min, and VGS, on = VGS, max |
Test voltage | Test control range: ±50V |
Pulse control | 1. Pulse frequency (square wave): 0kHz~500kHz; Accuracy: 2%±2LSB (The maximum frequency depends on the voltage, DUT capacitance) |
Alarm voltage VGSTH | 1. VTH voltage test & control range: |
IGS leakage current | Leakage Current Measurement Range: Covers 0.1nA~100mA, |
Machine power supply | Three-phase AC380V±38V |
Total weight | 700Kg (typical) |
Dimensions of machine | 800mm(W)x1400mm(D)x1950mm(H) |
AEC Q101、AQG 324、JEDEC JEP183A、JESD 22-A108
For SiC MOSFET, GaN transistor, IGBT module, MOS transistor