
The system performs high temperature forward bias reliability test for SiC MOSFET with reference to ACE-Q101E, AQG324 test method. Up to 5 stations can be tested in each test area, with independent pulse source configurations. RT~200°C test temperature is available for the device. It has the function of short-circuit disengagement test of test device, which can automatically detach the faulty device from the burn-in test without affecting the normal test of other devices.
Test temperature | RT~200°C (thermal plate) |
Test zone | 4 (scalable) |
Stations per zone | 5 (typical) |
Test Method | Pulse Current: Minimum Pulse Count: 50pulses~100pulses; Single Current Duration: 50μs~10ms |
Gate Threshold Voltage | Voltage Range: 0V~200V; Current Measurement Range: ±1A |
On-resistance / | Test Current Pulse Width: 100μs~200μs; Test Pulse Current Rise Time: 15μs |
System Control Solution | Cooling Mode: air cooling; Case Temperature Sampling Accuracy: ±1°C |
Drain Leakage Current | Measurement Range: 100V~2000V; Current Detection Range: 0mA~1mA |
Gate Leakage Current | Measured Voltage Range: -40V~40V; Current Detection Range: 0mA~1mA |
Machine power supply | Three-phase AC380V±38V |
Total weight | 700Kg (typical) |
Dimensions of machine | 800mm(W) x 1400mm(D) x 1950mm(H) (typical) |
AEC Q101、AQG 324
For SiC MOSFET