Successful Conclusion | Our Company Shines at 2026 IICIE International Integrated Circuit Innovation Expo

On September 11, the 2026 IICIE International Integrated Circuit Innovation Expo, themed "Cross-border Integration · Full-chain Collaboration, Building a Distinctive Chip Ecosystem", officially came to an end at Shenzhen World Exhibition & Convention Center (Bao'an). Over the three-day exhibition, the event gathered numerous enterprises. As an annual gathering for China’s semiconductor industry, it delivered many remarkable highlights worth recalling.

Highlight 1: Three Exhibitions Held in Parallel with Unprecedented Scale PART 1

The 2026 IICIE was co-located with CIOE China Optoelectronic Expo and elexcon Shenzhen International Electronics Fair. With a total exhibition area of 320,000 square meters, the event brought together more than 5,000 exhibitors and attracted over 240,000 professional visitors, making it one of the largest exhibition clusters for China’s semiconductor industry in 2026.

A considerable share of the massive professional audience came from chip design, packaging & test, and power device companies. These are core customers for aging and reliability testing solutions, bringing a steady stream of targeted visitors to our booth.

Highlight 2: Leaders Across the Entire Industry Chain Gather, Showcasing the Strong Capabilities of Domestic Players PART 2

Covering chip design, wafer fabrication, packaging & test, as well as equipment, materials and components, the expo featured the full semiconductor industry chain, demonstrating an increasingly complete domestic semiconductor supply chain.

The more mature the industrial chain becomes, the higher the performance of "China Chips", and the greater the requirements for test and verification. Burn-in screening and reliability testing constitute a critical link to ensure steady and sustainable development of this industrial chain.

We have witnessed that domestic semiconductor equipment is evolving from "breakthroughs in individual technologies" into a new phase of being "usable, adequate and mass-producible". This resonates perfectly with our company’s product philosophy of delivering stable, reliable and mass-production-ready solutions.

Highlight 3: A Bellwether of Cutting-edge Technologies; AI Computing Power and Wide-bandgap Semiconductors Take the Spotlight PART 3

The expo closely tracked the industry trends of 2026, showcasing a concentrated display of hot technologies including AI computing power, HBM memory, 2.5D/3D advanced packaging, CPO co-packaged optics, lithography technology and third-generation semiconductors.

The wide-bandgap semiconductor and power device segment featuring silicon carbide (SiC) and gallium nitride (GaN) drew huge crowds. Full-chain achievements ranging from substrate materials and epitaxial wafers to device design and module packaging were all on show, reflecting strong driving forces from downstream applications such as new energy vehicles and AI data centers.

AI computing chips are seeing record-high power consumption, automotive-grade chip access standards are becoming increasingly stringent, and wide-bandgap power devices are rapidly adopted in vehicles. The expo delivered a clear message: while chip performance is surging, reliability verification and burn-in testing are becoming an ever more critical link in the industrial chain.

Whether it is high-temperature and high-load burn-in screening for computing chips, or dynamic high-temperature reverse bias (DHTRB) verification for automotive-grade devices and power semiconductors, higher requirements are imposed on burn-in boards, test power supplies and test systems. This is exactly the field where our company has built deep expertise.

At this exhibition, our company presented at a 36 sqm booth (Booth No. 16D53). We displayed seven types of driver boards, 1U/2U special power supplies, PC power cycling test equipment and DHTRB dynamic test equipment, forming a core product portfolio covering burn-in testing and reliability verification for power devices.

Over the three-day show, our booth maintained strong visitor traffic. Professional visitors and partners from chip design, packaging & test, and power device sectors stopped by for in-depth discussions on product performance, test solutions and application cases. This exhibition not only fully demonstrated our technical capabilities and product layout, but also laid a solid foundation for further industry exchanges and expanded cooperation opportunities.

Short as the three-day exhibition was, we achieved fruitful results.

We would like to thank all new and existing friends who visited our booth 16D53.

Moving forward, our company will continue to deepen our expertise in semiconductor burn-in and reliability testing. With higher-quality products and solutions, we will safeguard the high-quality development of the integrated circuit industry.

The exhibition has come to an end, yet our cooperation has just begun.

If you were unable to attend the event in person, please feel free to contact us for product documentation and technical proposals.

Contact: 0571-86451253

Official Website: www.hkyq.com.cn